Due to the continuous miniaturization of the circuits and components, and to the great quantity of interconnections that this produces, the multilayer technology offers the possibility of vertical construction in several layers. This technology supposes an increasing market in all the sectors and applications.

In CIPSA we have presses that guarantee a homogeneous temperature in all the circuits during the pressing of the layers.

Determinant factor to guarantee a reliability and a quality in our final product with a minimization of the delamination risk.